PCB Rework Technician

About This Role

This role involves performing high-reliability rework on advanced PCBs, including custom ASICs, supporting engineering, validation, and bring-up efforts for an AI inference system company.

Responsibilities

• Perform precision rework and re-balling of very-large BGAs (> 70 mm) with high first-pass yield
• Operate large-format BGA rework systems, ensuring exact alignment, controlled thermal profiles, and clean re-flow on high-pin-count ICs
• Rework SMT and through-hole components down to 0402 packages, maintaining exceptional workmanship and consistency
• Read and interpret ECNs, schematics, layout files, and BOMs to execute component swaps and design modifications accurately
• Execute advanced board-level repairs: trace cuts, jumper-wire additions, micro-soldering, and circuit rerouting
• Inspect reworked assemblies with X-ray or AOI equipment to verify solder-joint integrity, alignment, and overall quality
• Maintain detailed rework documentation and clearly communicate findings or improvement ideas to engineers
• Collaborate closely with hardware, validation, and bring-up teams to support rapid iteration and tight project timelines

Requirements

• 5+ years of hands-on PCB rework experience on production-quality and/or R&D hardware
• Expertise with large BGAs (> 70 mm), fine-pitch QFNs/BGAs, and 0402-scale components
• Proficiency using advanced hot-air/IR rework platforms, precision microscopes, and large-area heaters
• Skill in following detailed engineering rework instructions, layout files, and schematics with minimal supervision
• Familiarity with IPC-A-610 and IPC-7711/21 workmanship and rework standards
• Exceptional attention to detail, steady manual dexterity, and strong visual-inspection skills

Qualifications

• 5+ years of hands-on PCB rework experience on production-quality and/or R&D hardware

Nice to Have

• Operating and programming X-ray or AOI systems for real-time inspection and failure analysis
• Performing micro-soldering, trace repair, and circuit rerouting on high-density, multi-layer boards
• Reballing custom ASIC packages and handling ultra-large, high-pin-count ICs
• Developing or optimizing thermal profiles for challenging package types (e.g., stacked dies, high-power BGAs)
• Documenting rework processes in MES/PLM systems and feeding back design-for-rework (DFR) recommendations
• Supporting engineering bring-up with rapid component swaps, blue-wire fixes, and on-the-fly design experiments

Skills

* Required skills